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Bond Testers
 
International Marketing Corporation offers Bond testers and micro testers from Dage Limited UK.
 
BT – 2400
Series – 3000
Series – 4000
Series - 4300
Series - 5000
 
Bond Tester 2400
 
 

Features
A multi purpose bond test system.
Easily interchangeable load cartridges to meet all the pull & shear applications.
Fully compliant with MIL & ASTM specs.

 
Specification

Physical Size (w x l x h) 310 x 680 x 700mm (12.5 x 27 x 27.5”)
Weight (unpacked) 55 Kgs
Power Supply 100/110, 220/240Vac, 50/60Hz, switchable
Interfaces RS232
Illumination 20W Halogen Floodlight
Load Cartridge Ranges Wire Pul : 100g/1Kg/10Kg, Electrically
Switchable, 25%/50%/100% of range
Die Shear: 10/20/50Kg with Intelligent Z positioning
Ball Shear: 100/200/500g 2/5Kg with Intelligent Z positioning
Tweezers Pull: Up to 10Kg (available early 1995)
Accuracy ±0.5% FSD all cartridges
Obstruction Wire Pull/tweezers L/c’s Z only
Sensing Shear cartridge Z and Y
Calibration Automatic: software controlled all cartridges
Operator Interfaces LCD Backlit 256 x 64 graphics LCD
Printer 40 column thermal
Keypad Failure coding keypad with user programmable Function keys (4)
 
 
Series 3000
 
 
Features
Two system Options, 100g or 1Kg.
Software selectable Multi-Range load cell  with tool rotation.
Patented Frictionless load Cartridge technology.
RS232 data output, for data transfer.
Integral data analysis.
Ergonomic design concept.
A comprehensive range of work holders and fixturing.
Fast and repeatable testing.
Provides a simple, low cost, test system for high throughput production environments
 
 
Series 4000
 
 
Features
Operator Friendly.
Image Capture.
Comprehensive Range of Work Surfaces & Work holders.
System Rigidity.
Serviceability.
Quick Release Intelligent Load Cartridge system.
Dage Frictionless System.
Cold Bump Pull.
Cavity Shear Testing.
Vector Pull Testing.
Optical Automation.
 
 
Series 4300
 
 
Features
Reduced Operat or handling of the 300MM    wafer.
Overcomes the need for operator dependant load tool to bump alignment.
Joystick manipulation of 100% of the wafer surface under the test head without need to Re-Position the wafer on the chuck.
Semi-Automatic Test routines for the bondtesting of the entire wafer surface without the need to re-position the Wafer on the chuck.

 
Application
The Semi-Automatric Handling and Testing of 300MM Bumped Wafers.
Optional Automatic Wafer Load/Unload Capability using customers Robot Handler and other SMIF Equipment.
Optional 200MM Wafer Capability.
 
Series - 5000
 
Features
Lower transducer ranges and over strain protection.
Optimised load tool designs.
Improved optics and illumination.
Sub-micron shear height accuracy.
Built in vibration isolation.
Improved load tool and sample manipulation.
Load tool and transducer protection.
 
 
  
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