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Pick & Place Machines
 
 IMC offers Pick & Place Machines from Universal Instruments Corporation.
 
Fine Pitch Placements
 
Advantis
GSM Genesis
High Speed Lightening Placement Head
 
High Speed Chip Shooters
 
HSP 4797
 
Advantis
 
Features
High-speed chip placement.
Flexible fine pitch. 
Platform machine built specifically for high performance at a low price.
End-of-line assembly tasks at the lowest possible cost-per-placement.

 Options
Advantis AC-30L
Advantis AX-72e
Advantis AC-40
 
Genesis
 
Features 
High speed placement.
Flexible, versatile.
Superior cost of ownership.
Maximum yield.
Optimal ease of use.
Ultimate in utilization.
 Definitive fine pitch.
Deinitive line balancer

Options
Genesis S series - GC11X , GC30
Genesis D series - GC60 , GC14
Genesis Q series - GC120Q 		 
 
 
High Speed Lightening Placement Head
 
Features
Fastest placement head technology with speed of 33600cph (Standard).
Compatible with Universal’s AdVantis and dual-head Genesis modular placement platforms.
Delivers chipshooting speeds in a platform system that succeeds in maintaining commonality of feeders, vision, heads and software with other Universal platform equipment.
The unique rotary motor drive developed for Lightning is based on Universal’s patented VRM (Variable Reluctance linear Motor) technology.
Lightning has 30 spindles, yielding substantially high placement rates in a pick and place configuration.
Features dual on-the-head cameras, enabling accurate placement at full speed, from sub-0201 components to CSP, WSP, m-BGA, and others up to 30mm square.
Lightning places devices such as CSP, WSP, uBGA, and Melfs at full speed.
 
HSP 4797
 
Features 
High-speed placement machine easily handles a broad range of components and board sizes.
Higher throughput, and greater machine utilization.
Lower operating cost.
Reliable, easy- to- use & easy-to-maintain machine.
Model
4797B
4797X
4797L
4797R
 
 
 
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