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AT-707
BGA /CSP placement & Rework Station |
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| At the click of an icon, the system automatically places the component
onto the PCB, shuts off the vacuum to the pick up tube, lifts the
pick up nozzle away from the package body, executes a reflow profile,
and raises the reflow head at the completion of a cycle. Removal features
the same automation only now, the vacuum stays on throughout the process
as the component is pulled off the board at the completion of the
cycle. Forced convection heating from both the top and bottom of the
PCB ensures unsurpassed temperature uniformity. The system is Lead-Free
compatible and features a unique software controlled two-stage soak
phase for large, high thermal mass assemblies. |
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AT-707FL
BGA/CSP Placement & Rework station |
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High level of automation limits intervention by the
operator which in turn translates into high yields and consistently
repeatable results. A Split Imaging Device creates diagonal corner
viewing for alignment of larger packages at high magnification. It
is also critical in viewing the walls of the nozzle in relation to
the PCB to ensure that adjacent components will not be interrupted
during reflow. Adjustable placement pressure ensures complete control
in rework of various package types.
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Profile
