Wafer Cleaning & Drying

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The RENA InWaClean removes slurry and sawing residues from separated wafers in a physical-chemical process.

Features and Benefits

  • The wafer is kept wet throughout the entire process until drying, in order to prevent the electrostatic bonding of particles
  • Ultrasonic cleaning employing various frequencies
  • No etching of wafer surface, thus best initial conditions for a variety of texture processes
  • Special roller construction reduces operating costs
  • Rinsing cascade reduces water consumption
  • RENA AirChannelDryer technology
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