CERAMIC TECH

Complete Solutions in CERAMIC TECH for ADVANCED ELECTRONICS

1. HYBRIDS in Semi Conductors

    APPLICATIONS IN AREAS OF DEFENSE ELECTRONICS/AUTOMATIVE SEMICONDUCTORS. SOLUTIONS FOR BOTH PRODUCTION AND R&D

The hybrid market is a steady growing industry, where we are able to follow a trend towards increasing layer count, miniaturization and automation.To satisfy the market requirements, we are working together with partners that not only have a high level of quality, but also supply the necessary service and maintenance for installed systems to guarantee a high customer satisfaction

Hybrids Process and Equipment's

a. AOI System:

    is an automated visual inspection of ceramic hybrids, LTCCs, HTCCs, interposers and other substrates where a camera autonomously scans the parts under test for both catastrophic failure (eg. missing component) and quality defects (eg. fillet size/shape or component skew).This technique is commonly used in the electronic circuits manufacturing process due to the fact it is a non-contact test method and it can be implemented at many stages

b. Probe Station;

    Each probe station is matched to fit your application. For each application the specific tool is mounted on the probe station. These systems are used to address hundreds of applications and have developed an unbeatable knowledge base of solutions to offer you.

C. Screen Printer;

    For most hybrid productions a screen printer is used to print bond pads/resistors/ conductors/ dielectric. This method is a cheap version in comparison to lithographic processes, since it does not disperse the material applied. In general the line widths and structures that are produced with printers cannot compare to those of lithographic processes. However, the line width that printers can achieve is steadily decreasing. In R&D the conductor thickness is as low as 20 µm. For production purposes the minimum print thickness used is approximately 80 µm. On a hybrid substrate multiple layers are printed that have to be aligned, so that a circuit can be established.

LTCC (Low Temp Co-fired Ceramics)

    The LTCC market is constantly growing due to the higher requirements of both packaging and reliability in the fields of:However the production of LTCC not only requires more machinery, but also the experience and process management to run a successful production.

We Provide:

  • Equipment and Consumables
  • Raw Materials (ceramic powder, green tapes, inks)
  • Process Support & Training
  • Technology Transfer
  • Project Management
  • Turn-Key Solution
  • CAD S/W
  • Training
  • Local Support

One necessary aspect in the production of LTCC is the inspection at multiple lactations in the production line. These inspections not only ensure a satisfactory product, but also increase the yield of the production.

PROCESS Steps;

  • Design of Circuit
  • Implementing the Design as LTCC
  • Production or Purchase of required tape and paste
  • Format Tapes
  • Punch the vias and cavities
  • Inspection
  • Fill vias
  • Inspect the print for process defects
  • Stack and laminate
  • Burnout and sinter
  • Post fire process
  • Populate ltcc