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Removal of the mechanical saw damage after the wafer is cut.

Features and Benefits

  • For fully and partially automated applications
  • Tank in tank design reduces space requirements and improves process homogeneity
  • Extension of the bath life due to bleed and feed function
  • Low breakage rates due to advanced handling and transport systems
  • Specially developed bath tank - carrier interface to prevent floating of wafers
  • Wafer size conversion just on the touch screen
  • Reproducible and stable processes