Inline junction isolation and rear side polishing
The InOxSide+ combines junction isolation and rear side polishing as a perfect
preparation for a superior surface passivation. The patented single side etching technology ensures powerful polishing already at low etch depths with lowest cost of ownership.
Features and Benefits
Fully automated wet chemical single side etching in an inline type
process on 5 lanes
Single side emitter etching, rear side polishing and removal of doped
glasses (PSG/BSG)
Uses HF/HNO3/H2SO4 for single side etching yielding the best-in-class
Cost of Ownership (CoO)
RENA patented technology
Adjustable rear side etching: 1 to 4 µm, up to 6 µm with RENA PreCon option)
Integrated rinsing and drying of wafer
Throughput up to 5000 wafer/hour
Compatible with M0, M1, M2, M4, M6 and M12 wafer size
Long bath lifetime due to feed-and-bleed function
Accurate dosing system for constant bath composition
Uses O-ring free roller design
Lowest breakage rate in industry
Based on RENA NIAK inline processing platform
High uptime
Easy maintenance
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