PRO 1600 Reflow Oven

Product Overview
PRO 1600 is a full forced air / nitrogen convection reflow oven. It has been designer for reflow of even the most challenging applications including, high thermal mass and lead free assemblies. A sealed heating chamber containing a fast ramping heater (up to 4° Celsius/ second) with the capability of 10 programmable zones, simulates profiles achievable by high volume production multi-zone ovens.
All profile parameters are individually programmed and are independent of one another. This translates into greater control over each profile making modifications, optimization, and adjustments easy and simple. Tight process control delivers unsurpassed temperature uniformity. An optional External Thermocouple Control (ETC) allows profiles to be executed based on the temperature reading of the part, not the air temperature around it. Increased productivity, superior performance and ease of operation make the PRO 1600 a versatile system ideal for small to medium run production, prototyping, testing or curing.
 
Key Features

  • Full Convection and Lead Free Compatible Reflow Oven
  • Up to 10 individually programmable zones
  • Small Footprint
  • Computer control with unlimited profile storage capacity
  • Comprehensive software package with monitoring and profiling capability
  • No Warm-Up time required before operating
  • Integrated Exhaust / Fume Cleaning Unit
  • Nitrogen ready with low rates of consumption
  • External Thermocouple Control
  • Automatic Profile Repeat function (up to 10 times)
  • Library of predefined profiles
  • Password protected login for engineers and operators
  • Plug and Operate Configuration
  • Minimal maintenance
  • Designed and Manufactured in US

 
Typical Reflow Applications

  • Printed Circuit Board (PCB) assemblies requiring high quality and repeatable results in prototype - medium volumes (depending on PCB size).
  • Single or Double Sided PCB’s with standard or Pb-Free solders.
  • Densely populated, high thermal mass assemblies.
  • Semiconductors per JEDEC 22-A113 and IPC / JEDEC J-STD-020 standards for Leaded and Pb-Free profiles.
  • Reflow of solder preforms in an inert atmosphere.
  • IPC-TM-650 Test Method 2.6.27 - Thermal Stress, Convection Reflow Assembly Simulation. 
  • Bare PCB’s to simulate profiles developed for volume production environments.
  • Delamination and other quality issues testing on multilayer PCB’s.
  • Various composite materials for analysis / testing.
  • Ceramic substrates to Gold Plated Nickel / Copper housings using preforms in an atmosphere with <50 PPM of Oxygen.
  • Copper heatsinks to PCB’s using preforms.
  • Gold / Tin reflow.
  • Pre-conditioning reflows of IC’s while in extruded aluminum tubes.
  • Aluminum pins to a metal housing.
  • Flex connector to ceramic substrate.
  • Surface Mount Devices / Passive Components to ceramic substrate.
  • Connector filters with fluxed preforms.
  • LED’s in production quantities.
  • Various solder pastes for analysis in an R&D environment.

 
Operation
Once the Power-Key switch is turned to the On position, top cover automatically opens while the loading tray slides out. Parts are loaded onto a mesh tray and the profile is selected with a few mouse clicks.
After the Start icon is activated, the tray automatically slides into the heating chamber at an adjustable and controlled speed. A profile is then executed as per the pre-programmed parameters. Software constantly monitors actual ramp up rates and temperature inside an oven to the programmed values for accuracy. At the completion of a reflow cycle, the tray automatically exits from a heating chamber. PRO 1600 is now in a standby mode, ready for a new cycle run.